Wireless communication with dielectric medium

ABSTRACT

An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims the benefit of the following U.S. ProvisionalPatent Applications: (i) Ser. No. 61/535,277, filed Sep. 15, 2011 andentitled “Wireless Power and Data Transfer System”; (ii) Ser. No.61/570,709, filed Dec. 14, 2011 and entitled “Dielectric and ShieldingArchitecture in an EHF Connector”; and (iii) Ser. No. 61/592,491, filedJan. 30, 2012 and entitled “Link Emission Control System and Method”;which applications are incorporated herein by reference in theirentirety for all purposes

TECHNICAL FIELD

This disclosure relates to systems and methods for EHF communications,including communication over a dielectric medium.

BACKGROUND

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits (ICs)with increasingly higher operational frequencies. In turn, electronicproducts and systems incorporating such integrated circuits are able toprovide much greater functionality than previous generations ofproducts. This additional functionality has generally included theprocessing of increasingly larger amounts of data at increasingly higherspeeds.

Many electronic systems include multiple printed circuit boards (PCBs)upon which these high-speed ICs are mounted, and through which varioussignals are routed to and from the ICs. In electronic systems with atleast two PCBs and the need to communicate information between thosePCBs, a variety of connector and backplane architectures have beendeveloped to facilitate information flow between the boards. Connectorand backplane architectures introduce a variety of impedancediscontinuities into the signal path, resulting in a degradation ofsignal quality or integrity. Connecting to boards by conventional means,such as signal-carrying mechanical connectors, generally createsdiscontinuities, requiring expensive electronics to negotiate.Conventional mechanical connectors may also wear out over time, requireprecise alignment and manufacturing methods, and are susceptible tomechanical jostling.

SUMMARY

In a first example, an electronic device may include a first dielectricsubstrate, at least a first electronic circuit supported by thesubstrate, for processing data, and at least a first communication unithaving a first antenna. The first communication unit may be mounted tothe substrate in communication with the at least a first electroniccircuit for converting between a first EHF electromagnetic signalcontaining digital information and a first data signal conducted by theat least a first electronic circuit. The first electromagnetic signalmay be transmitted or received along a first signal path by the firstantenna. A first electromagnetic (EM) signal guide assembly may includea first dielectric element made of a first dielectric material disposedproximate the first antenna in the first signal path. The first EMsignal guide may have sides extending along the first signal path. Afirst sleeve element may extend around the first dielectric elementalong at least a portion of the sides of the first dielectric element.The first sleeve element may impede transmission of the first EM signalthrough the sides of the first dielectric element.

In a second example, a first electronic connector element may include afirst EHF comm-link chip, a first dielectric material encasing the firstcomm-link chip and extending from the first chip toward a firstinterface surface spaced from the first comm-link chip. The firstcomm-link chip may be configured to transmit or receive anelectromagnetic signal having a first signal path extending through thedielectric material and the first interface surface. An electricallyconductive shielding material may be supported by the dielectricmaterial and may extend from a first side of the first interface surfacearound the first comm-link chip opposite the first interface surface toa second side of the first interface surface spaced from the first sideof the first interface surface.

In a third example, a system may include a first device and a seconddevice. The first device may include a first electrical circuit and afirst electronic connector component having a first dielectric material.A first EHF comm-link chip may be embedded in the first dielectricmaterial and connected to the first electrical circuit for communicatinga first electromagnetic signal that propagates along a first signal pathpassing through the first dielectric material. An electricallyconductive shielding layer may extend around at least a portion of thefirst signal path in the first dielectric material. The second devicemay include a second electrical circuit and a second electronicconnector component having a second dielectric material and a second EHFcomm-link chip embedded in the second dielectric material and connectedto the second electrical circuit for communicating a secondelectromagnetic signal that propagates along a second signal pathpassing through the second dielectric material. The first and second EHFcomm-link chips may be configured to communicate with each other whenthe first and second electronic connector components are positioned withthe first dielectric material in contact with the second dielectricmaterial with the first signal path aligned with the second signal path.Communication along the first and second signal paths may occursubstantially entirely through the first dielectric material and thesecond dielectric material.

A fourth example may include an adapter for interconnecting a firstelectronic device having a first electrically conductive connectorelement with a second electronic device having an EHF electromagneticsignal connector element. The adapter may include a dielectric material,an EHF comm-link chip embedded in the dielectric material and configuredto communicate the electromagnetic signal with the electromagneticsignal connector element, and a second electrically conductive connectorelement electrically connected to the comm-link chip and configured toelectrically connect to the first electrically conductive connectorelement.

In a fifth example, a system may include a first device and a seconddevice. The first device may include a first EHF comm-link chip assemblyconfigured to transmit a first EHF electromagnetic signal, a firstshield partly surrounding the first EHF comm-link chip assembly, and afirst circuit in communication with the first EHF comm-link chipassembly. The second device may have a second EHF comm-link chipassembly configured to receive the first EHF electromagnetic signal anda second shield partly surrounding the second EHF comm-link chipassembly. The first and second shields may be configured mutually tocreate a substantially continuous shield around the first and second EHFcomm-link chip assemblies when the first and second devices are aligned.

Advantages of such systems and methods will be more readily understoodafter considering the drawings and the Detailed Description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a simplified schematic overhead view of a first example ofan integrated circuit (IC) package including a die and antenna.

FIG. 2 shows a schematic side view of an exemplary communication deviceincluding an IC package and printed circuit board (PCB).

FIG. 3 shows an isometric view of another exemplary communication deviceincluding an IC package with external circuit conductors.

FIG. 4 shows a bottom view of the exemplary communication device of FIG.3.

FIG. 5 shows a perspective view of an exemplary portable deviceincluding an inductive power receiver and IC packages with dielectricguiding structures.

FIG. 6 shows a partially exploded view of the portable device of FIG. 5.

FIG. 7 shows the portable device of FIG. 5 facing an exemplary base unitincluding an inductive power source and IC packages.

FIG. 8 shows a side view of the portable device and base unit of FIG. 7in mutual alignment.

FIG. 9 shows a block diagram of unaligned exemplary first and secondelectronic devices each having partial shielding.

FIG. 10 shows a block diagram of aligned exemplary first and secondelectronic devices each having partial shielding.

FIG. 11 shows a perspective view of an exemplary connector.

FIG. 12 shows another perspective view of the exemplary connector ofFIG. 11.

FIG. 13 shows an exemplary connector proximate an exemplary externaldevice.

FIG. 14 shows a sectional view of an exemplary connector adjacent anexemplary external device.

FIG. 15 shows a plan view of a mating surface of an exemplary connector.

FIG. 16 shows a cross-section taken along line 16-16 in FIG. 15.

FIG. 17 shows a diagram of an exemplary adapter system.

DETAILED DESCRIPTION

Wireless communication may be used to provide signal communicationsbetween components on a device or may provide communication betweendevices. Wireless communication provides an interface that is notsubject to mechanical and electrical degradation. Examples of systemsemploying wireless communication between chips are disclosed in U.S.Pat. No. 5,621,913 and U.S. Published Patent Application No.2010/0159829, the disclosures of which are incorporated herein byreference in their entirety for all purposes.

In one example, tightly-coupled transmitter/receiver pairs may bedeployed with a transmitter disposed at a terminal portion of a firstconduction path and a receiver disposed at a terminal portion of asecond conduction path. The transmitter and receiver may be disposed inclose proximity to each other depending on the strength of thetransmitted energy, and the first conduction path and the secondconduction path may not be contiguous with respect to each other. Insome examples, the transmitter and receiver may be disposed on separatecircuit carriers positioned with the antennas of thetransmitter/receiver pair in close proximity.

As discussed below, a transmitter and/or receiver may be configured asan IC package, in which one or more antennas may be positioned adjacentto a die and held in place by a dielectric or insulating encapsulationor bond material. An antenna may also be held in place by a lead framesubstrate. Examples of EHF antennas embedded in IC packages are shown inthe drawings and described below. Note that IC packages may also bereferred to as simply packages, and are examples of wirelesscommunication units that are also variously referred to as EHFcommunication units, communication units, communication devices,comm-link chips, comm-link chip assemblies, comm-link chip packages,and/or comm-link packages, which may be configured in various ways. Forexample, IC packages, communication units, communication devices,comm-link chips, comm-link chip assemblies, comm-link chip packages,and/or comm-link packages may each include one or more ICs, chips, ordies and have circuit functionality appropriate for particularapplications.

FIG. 1 shows an exemplary IC package, generally indicated at 10. ICpackage 10 includes a chip or die 12, a transducer 14 providingconversion between electrical and electromagnetic (EM) signals, andconductive connectors 16, such as bond wires 18, 20 electricallyconnecting the transducer to bond pads 22, 24 connected to a transmitteror receiver circuit included in die 12. IC package 10 further includesan encapsulating material 26 formed around at least a portion of the dieand/or the transducer. In this example encapsulating material 26 coversdie 12, conductive connectors 16, and transducer 14, and is shown inphantom lines so that details of the die and transducer may beillustrated in solid lines.

Die 12 includes any suitable structure configured as a miniaturizedcircuit on a suitable die substrate, and is functionally equivalent to acomponent also referred to as a chip or an integrated circuit (IC). Adie substrate may be any suitable semiconductor material; for example, adie substrate may be silicon. Die 12 may have a length and a widthdimension, each of which may be about 1.0 mm to about 2.0 mm, andpreferably about 1.2 mm to about 1.5 mm. Die 12 may be mounted withfurther electrical conductors 16, such as a lead frame, not shown inFIG. 1, providing connection to external circuits. A transformer 28,shown in dashed lines, may provide impedance matching between a circuiton die 12 and transducer 14.

Transducer 14 may be in the form of a folded dipole or loop antenna 30,may be configured to operate at radio frequencies such as in the EHFspectrum, and may be configured to transmit and/or receiveelectromagnetic signals. Antenna 30 is separate from but operativelyconnected to die 12 by suitable conductors 16, and is located adjacentto die 12.

The dimensions of antenna 30 are suitable for operation in the EHF bandof the electromagnetic frequency spectrum. In one example, a loopconfiguration of antenna 30 includes a 0.1 mm band of material, laid outin a loop 1.4 mm long and 0.53 mm wide, with a gap of 0.1 mm at themouth of the loop, and with the edge of the loop approximately 0.2 mmfrom the edge of die 12.

Encapsulating material 26 is used to assist in holding the variouscomponents of IC package 10 in fixed relative positions. Encapsulatingmaterial 26 may be any suitable material configured to provideelectrical insulation and physical protection for the electrical andelectronic components of IC package 10. For example, encapsulatingmaterial 26, also referred to as insulating material, may be a moldcompound, glass, plastic, or ceramic. Encapsulating material 26 may alsobe formed in any suitable shape. For example, encapsulating material 26may be in the form of a rectangular block, encapsulating all componentsof IC package 10 except the unconnected ends of conductors 16 connectingthe die to external circuits. External connections may be formed withother circuits or components.

FIG. 2 shows a representational side view of a communication device 50including an IC package 52 flip-mounted to an exemplary printed circuitboard (PCB) 54. In this example, it may be seen that IC package 52includes a die 56, a ground plane 57, an antenna 58, bond wires,including bond wire 60, connecting the die to the antenna. The die,antenna, and bond wires are mounted on a package substrate 62 andencapsulated in encapsulating material 64. Ground plane 57 may bemounted to a lower surface of die 56, and may be any suitable structureconfigured to provide an electrical ground for the die. PCB 54 mayinclude a top dielectric layer 66 having a major face or surface 68. ICpackage 52 is flip-mounted to surface 68 with flip-mounting bumps 70attached to a metallization pattern (not shown).

PCB 54 may further include a layer 72 spaced from surface 68 made ofconductive material forming a ground plane within PCB 54. The PCB groundplane may be any suitable structure configured to provide an electricalground to circuits and components on PCB 54.

FIGS. 3 and 4 illustrate another exemplary communication device 80including an IC package 82 with external circuit conductors 84 and 86.In this example, IC package 82 may include a die 88, a lead frame 90,conductive connectors 92 in the form of bond wires, an antenna 94,encapsulating material 96, and other components not shown to simplifythe illustration. Die 88 may be mounted in electrical communication withlead frame 90, which may be any suitable arrangement of electricalconductors or leads 98 configured to allow one or more other circuits tooperatively connect with die 90. Antenna 94 may be constructed as a partof the manufacturing process that produces lead frame 90.

Leads 98 may be embedded or fixed in a lead frame substrate 100, shownin phantom lines, corresponding to package substrate 62. The lead framesubstrate may be any suitable insulating material configured tosubstantially hold leads 98 in a predetermined arrangement. Electricalcommunication between die 88 and leads 98 of lead frame 90 may beaccomplished by any suitable method using conductive connectors 92. Asmentioned, conductive connectors 92 may include bond wires thatelectrically connect terminals on a circuit of die 88 with correspondinglead conductors 98. For example, a conductor or lead 98 may include aplated lead 102 formed on an upper surface of lead frame substrate 100,a via 104 extending through the substrate, a flip-mounting bump 106mounting IC package 82 to a circuit on a base substrate, such as a PCB,not shown. The circuit on the base substrate may include externalconductors, such as external conductor 84, which for example, mayinclude a strip conductor 108 connecting bump 106 to a further via 110extending through the base substrate. Other vias 112 may extend throughthe lead frame substrate 100 and there may be additional vias 114extending through the base substrate.

In another example, die 88 may be inverted and conductive connectors 92may include bumps, or die solder balls, as described previously, whichmay be configured to electrically connect points on a circuit of die 88directly to corresponding leads 98 in what is commonly known as a “flipchip” arrangement.

A first and a second IC package 10 may be co-located on a single PCB andmay provide intra-PCB communication. In other examples, a first ICpackage 10 may be located on a first PCB and a second IC package 10 maybe located on a second PCB and may therefore provide inter-PCBcommunication.

Turning to FIGS. 5 and 6, an exemplary portable device will now bedescribed. A portable device 120 may be any device configured to bepowered wirelessly using an inductive power system and also tocommunicate wirelessly using one or more IC packages 10. Portable device120 may include an EHF communication circuit 122, a data storage unit124, local power storage device 126, and/or inductive power receiver128. The components of portable device 120 may be contained in a case(not shown). FIGS. 5 and 6 depict an example of a portable device 120showing possible locations of various components. FIG. 6 is a partiallyexploded version of the device shown in FIG. 5. A portable device mayalso be a portable media device (pmd), which may take the form of a cellphone, personal digital assistant (pda), MP3 players, notebook computer,or tablet.

EHF communication circuit 122 may be any circuit configured tocommunicate wirelessly using one or more IC packages 10. For example,EHF communication circuit 122 may include two IC packages 130 and 132,one configured as a transmitter and the other configured as a receiveras depicted in FIGS. 5 and 6. IC packages 130 and 132 may be configuredto communicate with other IC packages in other devices rather than withother such chips in the same device. In some examples, only one ICpackage may be included, with the IC package configured as atransceiver.

EHF communication circuit 122 may be in electrical communication withdigital data storage unit 124. Data storage unit 124 may be any suitabledata storage unit capable of reading and writing data. For example, datastorage unit 124 may be an IC chip, card, disk, or SSD. In typicaloperation, EHF communication circuit 122 may transfer data between datastorage unit 124 and an external device.

EHF communication circuit 122 may also receive power from local powerstorage device 126. Power storage device 126 may be any suitable deviceconfigured to store electrical energy for future use. For example, powerstorage device 126 may be a lithium ion battery, a fuel cell, anultracapacitor, or any other battery-like device that may be charged anddischarged. Typically, the voltage supplied by such a device may need tobe stepped down using suitable circuitry in EHF communication circuit122 to make the voltage usable by the circuit and IC packages. ICpackages such as IC package 130 and 132 typically operate in theapproximate range of 1.2 to 3.3 V.

Inductive power receiver 128 may be in electrical communication withlocal power storage device 126 and may function to charge power storagedevice 126. Inductive power receiver 128 may be any suitable devicecapable of receiving wireless energy transfer from a power source. Forexample, inductive power receiver 128 may include a secondary coil 129in which a current may be induced by a primary coil located in aseparate charging device.

Worldwide open standards for this sort of inductive charging have beendeveloped. For example the “Qi” standard developed by the Wireless PowerConsortium has begun to be utilized in commercial products.

The illustrative portable device 120 in FIGS. 5 and 6 may furtherinclude conductive suppressor 134, dielectric isolation barrier 136, anddielectric directing portion 138. Conductive suppressor 134 may be anysuitable structure configured to suppress ingress or egress of spuriousEHF radiation. For example suppressor 134 may be constructed as anexpanse of conductive material disposed laterally around dielectricisolation barrier 136. Dielectric isolation barrier 136 may be anysuitable structure or gap configured to isolate dielectric directingportion 138 from suppressor 134. For example, dielectric isolationbarrier 136 may be a low-E_(r) dielectric such as foam, or may be an airgap laterally surrounding dielectric directing portion 138. Dielectricdirecting portion 138 may be any suitable dielectric structureconfigured to enhance and/or direct EHF radiation. For example,dielectric directing portion 138 may be a block of high-E_(r) materialsuch as plastic.

A portable device such as portable device 120 may function independently(e.g., as a portable media device), and may interact and/or receivepower from other devices. For example, a base unit may be one suchdevice. As shown in FIGS. 7-8, a base unit 140 may be any suitabledevice configured to wirelessly communicate with portable device 120 andto wirelessly provide power to portable device 120. For example, baseunit 140 may include a housing (not shown) that encloses an inductivepower source 142 and/or an EHF communications circuit 144.

In some examples, base unit 140 may include or be in communication witha host controller (not shown), which may be any suitable device orcomponent configured to control the electronic activity of an overallsystem including portable device 120 and base unit 140. For example, ahost controller may be a personal computing device configured viasoftware and/or firmware to coordinate synchronization of data betweenportable device 120 and a personal computer. In other examples, a hostcontroller may include any or all of the following: a video player;audio player; security system; display system; music, video, and/oraudiobook organizer; data back-up storage system; portable phonemanager; etc.

Note that in some examples, at least some roles of the two devices maybe reversed. Accordingly, a host controller may be located in portabledevice 120 and base unit 140 may include a storage unit such as storageunit 124. In other examples, both devices may include host controllerand/or storage unit 124, enabling functionality such as device-to-devicedata copying. In other examples, portable device 120 may control atransaction wherein a video playing or available on portable device 120may appear on a base unit 140 that includes a video display. Thistransaction may be controlled entirely from the portable device.

Inductive power source 142 may be any suitable device configured toprovide electrical power wirelessly to inductive power receiver 128. Asdescribed above, inductive power source 142 may include primary coil146.

EHF communications circuit 144 may include one or more IC packages 10,such as IC packages 148 and 150, configured to transfer information toand from the IC package(s) in portable device 120. For each transmitterIC package in portable device 120, a corresponding receiver IC packagemay be provided in base unit 140. In similar fashion, a receiver inportable device 120 may have a corresponding transmitter in base unit140. In some examples, IC packages may be configured as transceivers,and each two-way link may be established using one IC package perdevice. To facilitate data transfer, the resulting transmitter-receiveror transceiver-transceiver pairs may be disposed such that propergeneral alignment of the devices also aligns all pairs of IC packages.

Alternatively, some transmitter-receiver or transceiver-transceiverpairs may be aligned when the devices are placed in a firstconfiguration while others may be aligned when the devices are placed ina second configuration. For example, a base unit 140 may provide twosets of markings on an interface surface. One set of markings mayindicate where to place portable device 120 to enable datasynchronization, while the other may indicate where to place portabledevice 120 to enable music playback or some other functionality, andboth positions may allow simultaneous battery charging.

FIGS. 7 and 8 show portable device 120 and a base unit 140. As depictedin FIG. 7, inductive power source 142 and IC packages 148 and 150 may bedisposed and configured in a spatial arrangement complementary to thecorresponding components in portable device 120. FIG. 8 furtherillustrates this complementary arrangement, depicting a portable device120 in docking alignment with base unit 140. As noted above, each devicemay include a single IC package configured as a transceiver rather thantwo IC packages respectively configured as a transmitter and receiver.

Regarding EHF signals that may be transmitted and received betweendevices such as portable device 120 and base unit 140, governmentalemissions limits may exist for a given licensed emissions band. It isnoted that an unmodulated signal may provide a narrower band ofemissions, thereby avoiding violation of an emissions limit in someapplications. On the other hand, a modulated signal may produce abroader band of emissions that in some applications may extend outsidethe licensed band.

FIGS. 9 and 10 are block diagrams showing two exemplary devicesconfigured to limit the production of emissions which may extend outsideof a given band. A portion of a first electronic device 160 may includetwo examples of IC packages 10, specifically a transmitter 162 and areceiver 164, electrically connected to a baseband modulation circuit169. A discontinuous shield 168 may partly surround IC packages 162 and164. For example, a portion of first electronic device 160 may include alayer or section of material that acts to inhibit or block EHF signals.Shield 168 may include any suitable material configured to inhibit orblock electromagnetic signals having an EHF frequency. For example, agrounded electromagnetically conductive material may drain an EHF signalto ground, and a dissipative material may absorb an EHF signal andconvert it to heat within the material. This shielding layer or sectionmay be discontinuous in the sense that it does not form a continuousshield in every direction, but rather includes an opening or openings inone or more directions. The partial shielding configuration isrepresented in FIGS. 9 and 10 as a U-shaped cross section. As furtherdescribed below, shield 168 may be configured to facilitate a matingrelationship with a corresponding shield on another device.

Transmitter chip 162 may be an example of the previously described ICpackage 10, and may be adapted to transmit an EHF signal provided by oneor more circuits in device 160 in upstream series with basebandmodulation circuit 169. For example, transmitter chip 162 may transmit asubstantially constant signal, a modulated signal, an intermittentsignal, a combination of these, or any other signal capable of beingtransmitted in the EHF band. Receiver chip 164 may also be an example ofthe previously described IC package 10, and may be adapted to receive anEHF signal and to provide that signal in electronic form to one or morecircuits in first device 160, including baseband modulation circuit 169.Note that transmitter and receiver packages 162 and 164 may be replacedin some examples by a single transceiver package configured to bothtransmit and receive.

Baseband modulation circuit 169 may be any suitable circuit configuredto select between two or more signals based on one or more inputs. Inthe embodiment shown in FIGS. 9 and 10, baseband modulation circuit 169may include a multiplexer circuit adapted to receive inputs fromtransmitter chip 162, receiver chip 164, a modulated signal generator,and one or more signal generating circuits, such as an unmodulatedsignal generator.

With continuing reference to FIGS. 9 and 10, a second electronic device176 may be similar to first device 160, and may include a transmitterchip 178, a receiver chip 180, a baseband modulation circuit 185, and ashield 184 with similar functions and connections as the correspondingcomponents of first device 160.

As depicted in FIGS. 9 and 10, devices 160 and 176 may be physicallymoved from a misaligned to an aligned relationship. In this context,alignment refers to axial and proximal alignment of thetransmitter-receiver pairs, namely transmitter 162 and receiver 180 aswell as transmitter 178 and receiver 164. In other examples, these maybe replaced by a suitable transceiver-transceiver pair. Proper alignmentof these pairs may allow EHF signal communication between at least oneof the pairs and thus communication between the first and seconddevices. The shields of devices 160 and 176 may also be configured toensure that the shields are aligned when the transmitter-receiver ortransceiver-transceiver pairs are in proper alignment. As mentionedpreviously, discontinuous shield 168 and discontinuous shield 184 may beconfigured as mates, capable of forming a single continuous shieldaround the pairs of IC packages when the shields are placed in analigned and mated position.

Turning now to FIGS. 11 and 12, an exemplary connector 200 incorporatingone or more IC packages 10 is depicted. Connector 200 may be anysuitable connector component configured to provide a zero- orlow-insertion EHF connection interface for a corresponding connectorcomponent on another device or system. Connector 200 may include twomagnets, 202 and 204, a connector PCB 206, two IC packages 10, labeledas 208 and 210, a connector body 212, and/or a connector alignmentportion 214. Furthermore, connector 200 may be electrically andphysically connected to a cable 216.

Connector body 212 may serve as a housing or container for othercomponents of connector 200. In some examples, connector body 212 mayencapsulate PCB 206 and IC packages 208 and 210 using a suitabledielectric material or materials. Connector body 212 may also be sizedand configured to allow convenient manipulation by a user. Magnets 202and 204 may be at least partially housed in connector body 212, and maybe mounted such that both magnets are substantially flush with a matingsurface 218 of connector body 212.

Mating surface 218 may be configured to provide a suitable physicalcoupling surface with a corresponding connector on a correspondingdevice. In some examples, mating surface 218 is planar. In otherexamples, mating surface 218 is curved. In still other examples, matingsurface 218 includes alignment portion 214. Alignment portion 214 may bea protrusion, ridge, knob, bevel, pin, recess, or other memberconfigured to mate with a corresponding portion on a correspondingtarget connection region 220 of an external device 222, as shown in FIG.13, to provide physical alignment feedback to a user.

Magnets 202 and 204 may be any suitable magnetic components configuredto releasably hold connector 200 in aligned proximity to targetconnection region 220 of external device 222. In this context, alignmentand proximity may refer to the alignment and proximity of correspondingIC packages, which may need to be substantially aligned and in closeenough proximity to enable communication between a given pair ofpackages. In some examples, magnets 202 and 204 are permanent magnets.In other examples, magnets 202 and 204 are electromagnets. In stillother examples, magnets 202 and 204 are constructed of ferrous materialcapable of being magnetically attracted to magnets on or near targetconnection region 220.

IC packages 208 and 210 may be mounted on connector PCB 206. In someexamples, more or fewer packages, assemblies, or chips may be provided.IC packages 208 and 210 may be mounted on PCB 206 such that an antennaof IC package 208 is oriented orthogonally to an antenna of IC package210, to take advantage of polarization effects. In other words,orthogonal orientation may allow the packages to be mounted closelytogether, because orthogonal EHF signals will not substantiallyinterfere with each other.

Connector PCB 206 and related circuits may be electrically connected tocable 216 to allow connector 200 to obtain power and/or informationalsignals from a source outside of connector 200. For example, cable 216may provide connector 200 with electrical power as well as providing adata signal path to and/or from a personal computer or other hostdevice.

FIG. 13 shows a connector 200 in close proximity to an illustrativeexternal device 222. As depicted in FIG. 13, external device 222 mayinclude an external device PCB 224 with two IC packages 226 and 228disposed near an edge 230 of the external device. In some examples, moreor fewer IC packages, each with one or more chips, may be provided.Target connection region 220 at edge 230 may include portions made offerrous material or any other material that provides a magneticallyattractive surface to which magnets 202 and 204 may attach. For example,placing connector 200 near target connection region 220 of externaldevice 222 may cause magnets 202 and 204 to be attracted to targetconnection region 220, pulling connector 200 into proper position andalignment to allow IC packages 208 and 210 to align and communicate withIC packages 226 and 228.

As depicted in FIG. 14, connector body 212 may include a firstdielectric material 232 at least partially surrounding IC package 208and/or 210 (shown in FIG. 14 as IC package 208 for convenience) and asecond dielectric material 234 at least partially surrounding firstdielectric material 232. First dielectric material 232 may have arelatively high dielectric constant compared to second dielectricmaterial 234. For example, dielectric material 232 may include plasticwith a dielectric constant of approximately 2 to approximately 5, whiledielectric material 234 may include a substance with a relatively muchlower constant. In some examples, dielectric material 234 may includefoam or an air gap.

First dielectric material 232 may be configured as a volume of materialspanning the region from IC package 208 to mating surface 218 ofconnector 200. This architecture, with a higher dielectric constantmaterial surrounded by a lower dielectric constant material, mayfacilitate focusing and shaping of a transmitted EHF signal throughdielectric material 232. In some examples, a correspondinghigh-dielectric material 236 may be included spanning from targetconnection region 220 at a surface of external device 222 to one or moreIC packages 238 within in the external device. In this example, aligningconnector 200 in close proximity with target connection region 220creates a path of substantially continuous dielectric material throughwhich an EHF signal can propagate from package 208 to package 238.

FIGS. 15 and 16 depict two views of a connector 250, which may be anexample of a connector 200 incorporating partial shielding similar tothat described with respect to FIGS. 9 and 10. FIG. 16 is across-section taken along line 16-16 of FIG. 15. Similar to connector200, connector 250 may include two magnets 252 and 254, a PCB 256, twoIC packages 258 and 260, and a body 262, with a first dielectricmaterial 264 proximate the IC packages and a second dielectric material266 having a lower dielectric constant surrounding first dielectricmaterial 264.

In this example, shielding material 268 may be provided in at least aportion of a connector body 262. Shielding material 268 may include anydissipative or electrically conductive material or layer configured toabsorb or otherwise block spurious incoming and outgoing EHF radiation.For example, shielding material 268 may include a copper sheet or layerwrapping around the IC packages and leaving at least a portion of amating surface 270 unshielded. In addition to acting as an absorptiveand/or dissipative shield with respect to EHF radiation, shieldingmaterial 268 may provide an electrical circuit ground for one or morecircuits in connector 250.

FIG. 17 is a simplified diagram depicting a side cut-out view of anexemplary adapter 280 incorporating some of the components describedabove. Adapter 280 may be any suitable system configured to adapt an ICpackage-enabled external device 282 to be used with a standardmechanical or physical plug-type connector. Adapter 280 may includeadapter sleeve 284, a female connector element 286, an IC package 288,and a dielectric and shielding architecture 290.

Adapter sleeve 284 may be a housing for the adapter and may also fitclosely around at least a portion of external device 282, aligning an ICpackage 292 of the external device with IC package 288. For example,adapter sleeve 284 may be configured as a partial case for the device.IC package 288 may align and communicate with IC package 292 in theexternal device when sleeve 284 is attached to device 282. IC package288 may also be in electrical communication with female connectorelement 286. Female connector element 286 may present a standard plug-inconnector interface to a corresponding male connector element 294 of aphysical plug-type connector.

IC package 288 may be embedded in or surrounded by a dielectric andshielding architecture 290 similar to architectures described above.Architecture 290 may include a high-dielectric constant material 296surrounding IC package 288, material 296 being at least partiallysurrounded by a low-dielectric constant material 298 as well as ashielding material or layer 300, as depicted in FIG. 17. Communicationof an EHF signal between IC packages 288 and 292 may be facilitated byarchitecture 290. A signal may also be communicated between IC package288 and male connector element 294 through female connector element 286,as described above. Accordingly, adapter 280 may adapt between aphysical connector system and an IC package-enabled,physical-connectorless external device 282.

Accordingly, a system, device, or method as described above forproviding wireless power and data transfer may include one or more ofthe following examples.

In a first example, an electronic device may include a first dielectricsubstrate, at least a first electronic circuit supported by thesubstrate, for processing data, and at least a first communication unithaving a first antenna. The first communication unit may be mounted tothe substrate in communication with the at least a first electroniccircuit for converting between a first EHF electromagnetic signalcontaining digital information and a first data signal conducted by theat least a first electronic circuit. The first electromagnetic signalmay be transmitted or received along a first signal path by the firstantenna. A first electromagnetic (EM) signal guide assembly may includea first dielectric element made of a first dielectric material disposedproximate the first antenna in the first signal path. The first EMsignal guide may have sides extending along the first signal path. Afirst sleeve element may extend around the first dielectric elementalong at least a portion of the sides of the first dielectric element.The first sleeve element may impede transmission of the first EM signalthrough the sides of the first dielectric element.

The first sleeve element may be made of one or more of an electricallyconductive material, an electromagnetically absorptive material, anelectromagnetically dissipative material, and a second dielectricmaterial having a dielectric constant that is lower than a dielectricconstant of the first dielectric element.

The first sleeve element may be made of the second dielectric materialand may have sides extending along the signal path corresponding to thesides of the first dielectric element. The signal guide may include asecond sleeve element disposed around the sides of the first sleeveelement, and may be made of the electromagnetically dissipativematerial.

The first communication unit may be a transceiver.

The at least a first communication unit may include a secondcommunication unit having a second antenna. The second communicationunit may be mounted to the substrate in communication with the at leasta first electronic circuit for converting between a second EHF EM signalcontaining digital information and a second data signal conducted by theat least a first electronic circuit. The second electromagnetic signalmay be transmitted or received along a second signal path by the secondantenna. The electromagnetic signal guide assembly may further include asecond dielectric element made of a third dielectric material disposedproximate the second antenna in the second signal path and having sidesextending along the second signal path. A second sleeve element mayextend around the second dielectric element along at least a portion ofthe sides of the second dielectric element. The second sleeve elementmay impede transmission of the second electromagnetic signal through thesides of the second dielectric element.

The second sleeve element may be made of a fourth dielectric materialhaving a dielectric constant that is lower than a dielectric constant ofthe second dielectric element. The second sleeve element may have sidesextending along the second signal path corresponding to the sides of thesecond dielectric element. The signal guide assembly may further includea sleeve assembly disposed around the sides of the first and secondsleeve elements, extending continuously between the first and secondsleeve elements, and being made of an electrically conductive material.

The first communication unit may be a transmitter and the secondcommunication unit may be a receiver.

An electronic system may include the first electronic device and asecond electronic device including a second dielectric substrate, atleast a second electronic circuit supported by the second substrate, forprocessing data, and at least a second communication unit having asecond antenna. The second communication unit may be mounted to thesecond substrate in communication with the at least a second electroniccircuit for converting between a second EHF EM signal containing digitalinformation and a second data signal conducted by the at least a secondelectronic circuit. The second EM signal may be transmitted or receivedalong a second signal path by the second antenna. A second EM signalguide assembly may include a second dielectric element made of a seconddielectric material disposed proximate the second antenna in the secondsignal path and having sides extending along the second signal path. Asecond sleeve element may extend around the second dielectric elementalong at least a portion of the sides of the second dielectric element.The second sleeve element may impede transmission of the secondelectromagnetic signal through the sides of the second dielectricelement.

The first communication unit may be a transmitter, and the secondcommunication unit may be a receiver configured to communicate with thefirst communication unit when the first guide assembly is positionedproximate to and facing the second guide assembly.

The first and second dielectric elements may have correspondingdimensions transverse to the respective first and second signal paths.When the first guide assembly is positioned proximate to and facing thesecond guide assembly and the second signal path is aligned with thefirst signal path, the first sleeve element may align with the secondsleeve element and the first and second sleeve elements in combinationmay impede transmission of the first electromagnetic signal through thesides of the first and second dielectric elements.

The first and second sleeve elements may be made of a material that formin combination an electrical, magnetic, or electromagnetic shieldextending along the first and second dielectric elements when the firstsleeve element is placed against the second sleeve element.

The first and second dielectric elements of the two guide assemblies mayhave same cross-section dimensions, and the first and second sleeveelements may extend behind the respective first and second communicationunits.

In a second example, a first electronic connector element may include afirst EHF comm-link chip, a first dielectric material encasing the firstcomm-link chip and extending from the first chip toward a firstinterface surface spaced from the first comm-link chip. The firstcomm-link chip may be configured to transmit or receive anelectromagnetic signal having a first signal path extending through thedielectric material and the first interface surface. A shieldingmaterial may be supported by the dielectric material and may extend froma first side of the first interface surface around the first comm-linkchip opposite the first interface surface to a second side of the firstinterface surface spaced from the first side of the first interfacesurface. The shielding material may be made of one or more of anelectrically conductive material, an electromagnetically absorptivematerial, and an electromagnetically dissipative material.

The shielding material may form a continuous loop around the interfacesurface.

The shielding material may be connected to a circuit ground of the firstcomm-link chip.

The shielding material may be configured to substantially absorb anddissipate EHF radiation that reaches the shielding material from theelectromagnetic signal.

A system may include first electronic connector element and a secondelectronic connector element. The first electronic connector element mayfurther include a first mating element forming at least a portion of thefirst interface surface. The second electronic connector element mayinclude a second EHF comm-link chip, a second mating surface spaced fromthe second comm-link chip, and a second mating element forming at leasta portion of a second interface surface. The second comm-link chip maybe configured to transmit or receive an electromagnetic signal having asecond signal path extending through the second interface surface. Thefirst and second mating elements being complementary and including acombination of a recess formed in one of the first and second interfacesurfaces and a protrusion formed in the other of the first and secondinterface surfaces, the protrusion being configured to be received inthe recess when the first and second interface surfaces are placed inclose proximity to each other. The first and second comm-link chips maybe configured to communicate an EHF signal between the first electronicconnector element and the second electronic connector element.

The first electronic connector element may further include a seconddielectric material at least partially surrounding the first dielectricmaterial transverse to the first signal path, The first dielectricmaterial may have a dielectric constant that is substantially higherthan a dielectric constant of the second dielectric material.

The first comm-link chip of the first electronic connector may includean integrated circuit (IC), an antenna in communication with the IC, andan insulating material holding the IC and antenna in a fixed location.

The first dielectric material of the first electronic connector elementmay have a dielectric constant between about 2 and about 5.

In a third example, a system may include a first device and a seconddevice. The first device may include a first electrical circuit and afirst electronic connector component having a first dielectric material.A first EHF comm-link chip may be embedded in the first dielectricmaterial and connected to the first electrical circuit for communicatinga first electromagnetic signal that propagates along a first signal pathpassing through the first dielectric material. An electricallyconductive shielding layer may extend around at least a portion of thefirst signal path in the first dielectric material. The second devicemay include a second electrical circuit and a second electronicconnector component having a second dielectric material and a second EHFcomm-link chip embedded in the second dielectric material and connectedto the second electrical circuit for communicating a secondelectromagnetic signal that propagates along a second signal pathpassing through the second dielectric material. The first and second EHFcomm-link chips may be configured to communicate with each other whenthe first and second electronic connector components are positioned withthe first dielectric material in contact with the second dielectricmaterial with the first signal path aligned with the second signal path.Communication along the first and second signal paths may occursubstantially entirely through the first dielectric material and thesecond dielectric material.

The electrically conductive shielding layer may be electricallyconductive and may be connected to a circuit ground for the firstelectrical circuit.

The electrically conductive shielding layer may be configured tosubstantially absorb and dissipate EHF electromagnetic radiation.

A fourth example may include an adapter for interconnecting a firstelectronic device having a first electrically conductive connectorelement with a second electronic device having an EHF electromagneticsignal connector element. The adapter may include a dielectric material,an EHF comm-link chip embedded in the dielectric material and configuredto communicate the electromagnetic signal with the electromagneticsignal connector element, and a second electrically conductive connectorelement electrically connected to the comm-link chip and configured toelectrically connect to the first electrically conductive connectorelement.

The adapter may further include a sleeve forming a channel. Thecomm-link chip may be disposed at a first end of the channel. The sleevemay be sized and configured to receive the electromagnetic signalconnector element.

In a fifth example, a system may include a first device and a seconddevice. The first device may include a first EHF comm-link chip assemblyconfigured to transmit a first EHF electromagnetic signal, a firstshield partly surrounding the first EHF comm-link chip assembly, and afirst circuit in communication with the first EHF comm-link chipassembly. The second device may have a second EHF comm-link chipassembly configured to receive the first EHF electromagnetic signal anda second shield partly surrounding the second EHF comm-link chipassembly. The first and second shields may be configured mutually tocreate a substantially continuous shield around the first and second EHFcomm-link chip assemblies when the first and second devices are aligned.

The first EHF comm-link chip assembly may be in communication with thefirst circuit and configured to receive a second EHF electromagneticsignal when the first and second devices are aligned. The second devicemay further include a second circuit, the second EHF comm-link chipassembly being in communication with the second circuit and configuredto transmit the second EHF electromagnetic signal.

The first and second devices may be configured such that alignment ofthe devices results in substantial alignment of the first and second EHFcomm-link chip assemblies, and substantial alignment of the first andsecond EHF comm-link chip assemblies includes both lateral and proximalalignment sufficient to enable adequate signal communication between thefirst and second EHF comm-link chip assemblies.

The first EHF comm-link chip assembly may include insulating material,an integrated circuit (IC), and an antenna that communicates with the ICand is fixed in location relative to the IC by the insulating material.

INDUSTRIAL APPLICABILITY

The inventions described herein relate to industrial and commercialindustries, such as electronics and communications industries usingdevices that communicate with other devices or devices havingcommunication between components in the devices.

It is believed that the disclosure set forth herein encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Eachexample defines an embodiment disclosed in the foregoing disclosure, butany one example does not necessarily encompass all features orcombinations that may be eventually claimed. Where the descriptionrecites “a” or “a first” element or the equivalent thereof, suchdescription includes one or more such elements, neither requiring norexcluding two or more such elements. Further, ordinal indicators, suchas first, second or third, for identified elements are used todistinguish between the elements, and do not indicate a required orlimited number of such elements, and do not indicate a particularposition or order of such elements unless otherwise specifically stated.

Although the present invention has been shown and described withreference to the foregoing operational principles and preferredembodiments, it will be apparent to those skilled in the art thatvarious changes in form and detail may be made without departing fromthe spirit and scope of the invention. The present invention is intendedto embrace all such alternatives, modifications and variances that fallwithin the scope of the appended claims.

We claim:
 1. An electronic device comprising: a first dielectricsubstrate; at least a first electronic circuit supported by thesubstrate, for processing data; at least a first communication unithaving a first antenna, the first communication unit mounted to thesubstrate in communication with the at least a first electronic circuitfor converting between a first EHF electromagnetic signal containingdigital information and a first data signal conducted by the at least afirst electronic circuit, the first electromagnetic signal transmittedor received along a first signal path by the first antenna; and a firstelectromagnetic signal guide assembly including a first dielectricelement made of a first dielectric material disposed proximate the firstantenna in the first signal path and having sides extending along thefirst signal path, and a first sleeve element extending around the firstdielectric element along at least a portion of the sides of the firstdielectric element, the first sleeve element impeding transmission ofthe first electromagnetic signal through the sides of the firstdielectric element.
 2. The electronic device of claim 1, wherein thefirst sleeve element is made of one of an electrically conductivematerial, an electromagnetically absorptive material, anelectromagnetically dissipative material, and a second dielectricmaterial having a dielectric constant that is lower than a dielectricconstant of the first dielectric element.
 3. The electronic device ofclaim 2, wherein the first sleeve element is made of the seconddielectric material and has sides extending along the signal pathcorresponding to the sides of the first dielectric element, and thesignal guide includes a second sleeve element disposed around the sidesof the first sleeve element and made of the electromagneticallydissipative material.
 4. The electronic device of claim 1, wherein thefirst communication unit is a transceiver.
 5. The electronic device ofclaim 1, wherein the at least a first communication unit includes asecond communication unit having a second antenna, the secondcommunication unit mounted to the substrate in communication with the atleast a first electronic circuit for converting between a second EHFelectromagnetic signal containing digital information and a second datasignal conducted by the at least a first electronic circuit, the secondelectromagnetic signal transmitted or received along a second signalpath by the second antenna; and wherein the electromagnetic signal guideassembly further includes a second dielectric element made of a thirddielectric material disposed proximate the second antenna in the secondsignal path and having sides extending along the second signal path, anda second sleeve element extending around the second dielectric elementalong at least a portion of the sides of the second dielectric element,the second sleeve element impeding transmission of the secondelectromagnetic signal through the sides of the second dielectricelement.
 6. The electronic device of claim 5, wherein the second sleeveelement is made of a fourth dielectric material having a dielectricconstant that is lower than a dielectric constant of the seconddielectric element, the second sleeve element having sides extendingalong the second signal path corresponding to the sides of the seconddielectric element, and the signal guide assembly further includes asleeve assembly disposed around the sides of the first and second sleeveelements, extending continuously between the first and second sleeveelements, and being made of one of an electrically conductive material,an electromagnetically absorptive material, and an electromagneticallydissipative material.
 7. The electronic device of claim 5, wherein thefirst communication unit is a transmitter and the second communicationunit is a receiver.
 8. An electronic system comprising the electronicdevice of claim 1 as a first electronic device, the electronic systemfurther comprising a second electronic device including: a seconddielectric substrate; at least a second electronic circuit supported bythe second substrate, for processing data; at least a secondcommunication unit having a second antenna, the second communicationunit mounted to the second substrate in communication with the at leasta second electronic circuit for converting between a second EHFelectromagnetic signal containing digital information and a second datasignal conducted by the at least a second electronic circuit, the secondelectromagnetic signal transmitted or received along a second signalpath by the second antenna; and a second electromagnetic signal guideassembly including a second dielectric element made of a seconddielectric material disposed proximate the second antenna in the secondsignal path and having sides extending along the second signal path, anda second sleeve element extending around the second dielectric elementalong at least a portion of the sides of the second dielectric element,the second sleeve element impeding transmission of the secondelectromagnetic signal through the sides of the second dielectricelement.
 9. The electronic system of claim 8, wherein the firstcommunication unit is a transmitter, the second communication unit is areceiver configured to communicate with the first communication unitwhen the first guide assembly is positioned proximate to and facing thesecond guide assembly.
 10. The electronic system of claim 9, wherein thefirst and second dielectric elements have corresponding dimensionstransverse to the respective first and second signal paths, and when thefirst guide assembly is positioned proximate to and facing the secondguide assembly and the second signal path is aligned with the firstsignal path, the first sleeve element aligns with the second sleeveelement and the first and second sleeve elements in combination impedetransmission of the first electromagnetic signal through the sides ofthe first and second dielectric elements.
 11. The electronic system ofclaim 10, wherein the first and second sleeve elements are made of amaterial that forms in combination an electric, magnetic, orelectromagnetic shield extending along the first and second dielectricelements when the first sleeve element is placed against the secondsleeve element.
 12. The electronic system of claim 11, wherein the firstand second dielectric elements of the two guide assemblies have samecross-section dimensions, and the first and second sleeve elementsextend behind the respective first and second communication units.
 13. Afirst electronic connector element comprising: a first EHF comm-linkchip, a first dielectric material encasing the first comm-link chip andextending from the first chip toward a first interface surface spacedfrom the first comm-link chip, the first comm-link chip being configuredto transmit or receive an electromagnetic signal having a first signalpath extending through the dielectric material and the first interfacesurface, and a shielding material supported by the dielectric materialand extending from a first side of the first interface surface aroundthe first comm-link chip opposite the first interface surface to asecond side of the first interface surface spaced from the first side ofthe first interface surface, the shielding material being made of one ofan electrically conductive material, an electromagnetically absorptivematerial, and an electromagnetically dissipative material.
 14. The firstelectronic connector element of claim 13, wherein the shielding materialforms a continuous loop around the interface surface.
 15. The firstelectronic connector element of 13, wherein the shielding material iselectrically conductive and is connected to a circuit ground of thefirst comm-link chip.
 16. The first electronic connector element of 13,wherein the shielding material is configured to substantially absorb anddissipate EHF radiation that reaches the shielding material from theelectromagnetic signal.
 17. A system comprising the first electronicconnector element of claim 13 and a second electronic connector element,the first electronic connector element further comprising a first matingelement forming at least a portion of the first interface surface, thesecond electronic connector element comprising a second EHF comm-linkchip, a second mating surface spaced from the second comm-link chip anda second mating element forming at least a portion of a second interfacesurface, the second comm-link chip being configured to transmit orreceive an electromagnetic signal having a second signal path extendingthrough the second interface surface, the first and second matingelements being complementary and including a combination of a recessformed in one of the first and second interface surfaces and aprotrusion formed in the other of the first and second interfacesurfaces, the protrusion being configured to be received in the recesswhen the first and second interface surfaces are placed in closeproximity to each other, and the first and second comm-link chips areconfigured to communicate an EHF signal between the first electronicconnector element and the second electronic connector element.
 18. Thefirst electronic connector element of claim 13, further comprising asecond dielectric material at least partially surrounding the firstdielectric material transverse to the first signal path, the firstdielectric material having a dielectric constant that is substantiallyhigher than a dielectric constant of the second dielectric material. 19.The first electronic connector element of claim 13, wherein the firstcomm-link chip includes an integrated circuit (IC), an antenna incommunication with the IC, and an insulating material holding the IC andantenna in a fixed location.
 20. The first electronic connector elementof claim 13, wherein the first dielectric material has a dielectricconstant between approximately 2 and approximately
 5. 21. A systemcomprising: a first device including a first electrical circuit and afirst electronic connector component having a first dielectric material,a first EHF comm-link chip embedded in the first dielectric material andconnected to the first electrical circuit for communicating a firstelectromagnetic signal that propagates along a first signal path passingthrough the first dielectric material, and an electrically conductiveshielding layer extending around at least a portion of the first signalpath in the first dielectric material; and a second device including asecond electrical circuit and a second electronic connector componenthaving a second dielectric material and a second EHF comm-link chipembedded in the second dielectric material and connected to the secondelectrical circuit for communicating a second electromagnetic signalthat propagates along a second signal path passing through the seconddielectric material, the first and second EHF comm-link chips beingconfigured to communicate with each other when the first and secondelectronic connector components are positioned with the first dielectricmaterial in contact with the second dielectric material with the firstsignal path aligned with the second signal path, and communication alongthe first and second signal paths occurs substantially entirely throughthe first dielectric material and the second dielectric material. 22.The system of claim 21, wherein the electrically conductive shieldinglayer is a circuit ground for the first electrical circuit.
 23. Thesystem of claim 21, wherein the electrically conductive shielding layeris configured to substantially absorb and dissipate EHF electromagneticradiation.
 24. An adapter for interconnecting a first electronic devicehaving a first electrically conductive connector element with a secondelectronic device having an EHF electromagnetic signal connectorelement, the adapter including a dielectric material; an EHF comm-linkchip embedded in the dielectric material and configured to communicatethe electromagnetic signal with the electromagnetic signal connectorelement; and a second electrically conductive connector elementelectrically connected to the comm-link chip and configured toelectrically connect to the first electrically conductive connectorelement.
 25. The adapter of claim 24, further comprising a sleeveforming a channel, the comm-link chip being disposed at a first end ofthe channel, the sleeve being sized and configured to receive theelectromagnetic signal connector element.
 26. A system comprising: afirst device including a first EHF comm-link chip assembly configured totransmit a first EHF electromagnetic signal, a first shield partlysurrounding the first EHF comm-link chip assembly, and a first circuitin communication with the first EHF comm-link chip assembly; and asecond device having a second EHF comm-link chip assembly configured toreceive the first EHF electromagnetic signal and a second shield partlysurrounding the second EHF comm-link chip assembly; the first and secondshields being configured mutually to create a substantially continuousshield around the first and second EHF comm-link chip assemblies whenthe first and second devices are aligned.
 27. The system of claim 26,wherein the first EHF comm-link chip assembly is in communication withthe first circuit and configured to receive a second EHF electromagneticsignal when the first and second devices are aligned; the second devicefurther includes a second circuit, the second EHF comm-link chipassembly being in communication with the second circuit and configuredto transmit the second EHF electromagnetic signal.
 28. The system ofclaim 26, wherein the first and second devices are configured such thatalignment of the devices results in substantial alignment of the firstand second EHF comm-link chip assemblies, and substantial alignment ofthe first and second EHF comm-link chip assemblies includes both lateraland proximal alignment sufficient to enable adequate signalcommunication between the first and second EHF comm-link chipassemblies.
 29. The system of claim 26, wherein the first EHF comm-linkchip assembly includes insulating material, an integrated circuit (IC),and an antenna that communicates with the IC and is fixed in locationrelative to the IC by the insulating material.